Hi, Is expose basis metal on pcb's circuitry, as a result of assembly process scratches, and not as a defective solder mask, acceptable under IPC 610/J-STD-001? I have concluded that IPC-610 does not addresses this as a condition, other then being mentioned as an element of a rejectable solder mask degradation, 7.2.1, figure 7-9. I have, also, noticed that correction amendment, January 1996, removed the expose bare copper from the rejectable conditions for class 2,3 on 7.2.2, figure 7-12. I'm really looking at tiny spots (approx. .010" dia. max). Any help would be appreciated. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################