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August 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Aug 1999 10:51:20 +1000
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This must be a problem season :
after flakes, cabbages and roses , I have this copper "boulders" alloy
problem :
On our routine microsectioning of (4umNi + 0.3umAu; 63/37) joints we
discovered we have rather interesting phenomenon :
After the obvious dissolution of gold ; there are sitting on top of Nickel
(admittedly bit thin ; still , continuous) microcracked boulders (about same
dia as the Ni layer) .
when we zoomed scan on them ; we found they're CuSn alloy ! Looks like a
smallpoxed nickel face .
Now our regular profiling 's telling us we're nowhere near this alloying
scenarios ;
and we ponder about the cracking propagations ; the Q is :

Where are this aliens coming from ?
Contaminants of tubs from some previous process ?
Smudged sample polish ?
Appears only on one specific fab supply .

Paul Klasek
http://www,resmed,com

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