in good form today- 3 replies to technet - its all steve's doing. by the
way if it jogs everyone so badly 3 X 1657 and lord we will crash the server.
quote

the electroless Ni/Au process is filled with so many extras besides the
Nickel and Gold -( phosphorus and lot of other additives) the problem could
be copper contamination in El Nickel bath.
await results
anil


-----Original Message-----
From: Paul Klasek <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, August 26, 1999 6:28 AM
Subject: [TN] Nickel plating contaminants ; cracking propagations ?


>This must be a problem season :
>after flakes, cabbages and roses , I have this copper "boulders" alloy
>problem :
>On our routine microsectioning of (4umNi + 0.3umAu; 63/37) joints we
>discovered we have rather interesting phenomenon :
>After the obvious dissolution of gold ; there are sitting on top of Nickel
>(admittedly bit thin ; still , continuous) microcracked boulders (about
same
>dia as the Ni layer) .
>when we zoomed scan on them ; we found they're CuSn alloy ! Looks like a
>smallpoxed nickel face .
>Now our regular profiling 's telling us we're nowhere near this alloying
>scenarios ;
>and we ponder about the cracking propagations ; the Q is :
>
>Where are this aliens coming from ?
>Contaminants of tubs from some previous process ?
>Smudged sample polish ?
>Appears only on one specific fab supply .
>
>Paul Klasek
>http://www,resmed,com
>
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