in good form today- 3 replies to technet - its all steve's doing. by the way if it jogs everyone so badly 3 X 1657 and lord we will crash the server. quote the electroless Ni/Au process is filled with so many extras besides the Nickel and Gold -( phosphorus and lot of other additives) the problem could be copper contamination in El Nickel bath. await results anil -----Original Message----- From: Paul Klasek <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Thursday, August 26, 1999 6:28 AM Subject: [TN] Nickel plating contaminants ; cracking propagations ? >This must be a problem season : >after flakes, cabbages and roses , I have this copper "boulders" alloy >problem : >On our routine microsectioning of (4umNi + 0.3umAu; 63/37) joints we >discovered we have rather interesting phenomenon : >After the obvious dissolution of gold ; there are sitting on top of Nickel >(admittedly bit thin ; still , continuous) microcracked boulders (about same >dia as the Ni layer) . >when we zoomed scan on them ; we found they're CuSn alloy ! Looks like a >smallpoxed nickel face . >Now our regular profiling 's telling us we're nowhere near this alloying >scenarios ; >and we ponder about the cracking propagations ; the Q is : > >Where are this aliens coming from ? >Contaminants of tubs from some previous process ? >Smudged sample polish ? >Appears only on one specific fab supply . > >Paul Klasek >http://www,resmed,com > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >847-509-9700 ext.5365 >############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################