Hi Technetters,
        I've a question of what is the formulae that used to calculate for the
stencil aperture opening on the 20 mils pitch IC? This question is more on
the amount of solder volume that sufficiently to meet the strength as well
as the reliability. Is there any different of the clean vs no-clean
process? HASL finishing vs Entek (OSP)?
Hope to some words for reference.

Thanks in advance,
Alvin

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