Marvin,
Pls specify if your problem is panel or pattern plating.What kind of
distribution do you have in mind:surface or hole/surface?

Edward Szpruch
Eltek , process engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9305050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: marvin v. picardal [SMTP:[log in to unmask]]
> Sent: ד ספטמבר 01 1999 0:25
> To:   [log in to unmask]
> Subject:      [TN] how to improve plating distribution
> 
> TECHnet'rs,
> Greetings!!! PCB Geniuses
> 
> I want to gather suggestions regarding items to be considered to maintain
> even distribution for copper plating. So far I have already evaluated the
> effect of board spacing, organic chemical dosage control, tank design
> modification. But the result shows only few developments.
> 
> Other related principles such as that of mass transfer would be of great
> help.
> 
> thank you.
> 
> 
> Marvin
> Chemical Engineer
> PWB
> 
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