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August 1999

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Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Date:
Fri, 27 Aug 1999 09:07:00 -0400
X-To:
Nicholas LAI <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, KELLY M SCHRIVER <[log in to unmask]>
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Nicholas -

Thermal pads and thermal vias are one of several design techniques to aid in
the conductive cooling of electronic components with large power dissipations.
 The objective being to either redistribute the heat or conduct it to a
thermal plane or thermal rail which can ultimately remove the heat from the
circuit card assembly.

Regards - Kelly

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