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August 1999

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TechNet <[log in to unmask]>
Subject:
Solder paste on Test Point
From:
Nick Nicolaides <[log in to unmask]>
Date:
Wed, 25 Aug 1999 14:58:55 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Nick Nicolaides <[log in to unmask]>
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On double reflow boards our ICT test engineers now want to solder paste the
solder side test points prior to reflow. We do not see any advantage to this
but about 2000 more holes in the stencil. What are your ICT people saying.

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