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Tue, 24 Aug 1999 07:07:14 -0700 |
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SEM Lab, Inc. |
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Hi all,
Thanks for all replies to my original question about chip capacitor
failure rates. I am currently involved in an issue where high leakage
current failures (~300 microamps at 50V) occur at a fairly significant
rate on chip caps that are on the top side of a mixed PTH/SMT assembly.
SMT components are reflowed in an IR oven and then the PTH components
are stuffed and wave soldered. I read through John Maxwell's (AVX)
papers and it appears that he recommends a solder wave temperature of
232 +/- 2 degrees C for assemblies with chip capacitors. My clients use
a 260 degree C wave (which I have always thought was typical). Do any
of you follow Maxwell's recommendations?
Best regards,
Ed
--
SEM Lab, Inc.
Scanning Electron Microscopy and Failure Analysis
Snohomish, WA
(425)335-4400
http://www.sem-lab.com
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