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Fri, 20 Aug 1999 22:30:13 EDT |
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Hi Greg,
While fast heating can set up stresses due to thermal gradients in chip
capacitors (CCs), there is evidence that the cooling rate after the
solidification of the solder may be more critical. That is particularly so in
the presence of large solder fillets. I would think the actual rates would be
size and construction dependent.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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