The following posting is a copy of a recent letter.  The attached file is an Adobe
Acrobat .pdf of the promotional brochure with additional information. 

August 20, 1999

To:  OEMs doing Electronics Assembly, Assembly Equipment Manufacturers, Electronic
Manufacturing Services Companies, and Component manufacturers

Subject:  IPC Summit meeting on Bulk Feeding of components for electronic assembly

Dear Colleagues,

Is your company involved in the bulk feeding of components for electronics assembly? 
Are you interested?  IPC has organized a summit meeting for the exchange of
information on bulk feeding.  

The Summit will be held on Thursday and Friday, September 23 * 24, 1999 at the Hilton
Hotel, 2855 North Milwaukee Ave., Northbrook, (Chicago) IL. To reserve a sleeping
room (IPC rate of $129) contact the Hilton Hotel at 847-480-7500. The Northbrook
Hilton is 15 minutes north of O'Hare International Airport. The meeting starts a 1pm
on the 23rd and concludes at 4:30 on Friday. Registration is required.

The objective of the meeting is to inform/educate the industry regarding the issues
associated with bulk feeding of components in electronics assembly. In addition, an
attempt will be made to come to agreement on standardized component dimensions and
tolerances; standardized packaging.  A white paper report on the opportunities and
barriers to bulk feeding is also being considered.

Attached you will find a PDF file of the announcement and the registration form for
the summit meeting.  Please feel free to forward this announcement on to anyone you
know that might potentially be interested in bulk feeding technology.  

To register, please print out the PDF file, write in your registration information
and fax the form to IPC at 847-509-9798.  For more information regarding the summit,
please contact me at [log in to unmask] or  Anthony Hilvers at [log in to unmask]

If you are doing bulk feeding, or are interested in finding out more, the IPC Bulk
Feeding summit should not be missed.

Cordially,
David W. Bergman
Vice President Standards and Technology