Hi Steve,
Guess I was not clear enough. When I said "GOOD to BAD (depending on severity 
of operational T-cycles)—partially filled vias, particularly with the 
transition from fill to no-fill near the PCB center (stress concentration)", 
I meant PCB center in the thickness direction, not edge vs. middle——so relax 
in this regard.
In regards your question about what to do:
(1) given your described application, I do not see a reliability issue;
(2) I would advise the customer laying out the scenario that 001 can be 
interpreted either way andthat there is no real tachnicalissue; I would hope 
the customer is reasonable and appreciates your forthrightness rather than 
you trying to pull a fast one;
(3) you may want to provide your customer with a copy of the exchange on the 
TN.
Good luck

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com 

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