Narayana;
I used this option back in 96 at my last employer, It worked very well for
solder paste coverage but due to time consuming and production cycle time we
had to choose most critical area for inspection in order to not decrease our
production rate. Today probably the inspection will be fast and the coverage
area bigger at same time that I spent in 96. The software give you options
to inspect like fixed frequency or random readings, also you can set the
inspection parameters like acceptance criteria and will track performance
trough SPC data.
I didn't note any false failure that time, I were using HASL board and
Paste and Pad contrast were very good, besides the fact that machine allow
you see the failure and you can accept or not. Smeared paste is a rejection
that you can caught with 3D option, but if I remember well you can set
limits over 100% coverage and program as rejection. The failure rate were
not so high, just a few cases in a high volume production, but that
particular board could not have any potencial failure at our costumer and we
fell more confortable using 2D inspection.( You get failure sometimes at
first print, after a long down time, bad cleaned stencil, stencil wiper
failures/problems, dried solder paste, etc ... )
For good performance we looked for critical parts coverage without loosing
board production ( remember we were high volume ), but if you have time
available you can cover more parts, first choose the ICs ( BGA, QFPs, TSOPs,
etc ) then go to easy components.
I didn't known the performance for flex circuits, but if you have a good
contrast the system will work well.
You can contact MPM also for more details, Motorola has a strong
relationship with MPM ( in fact Motorola has good relantionship with almost
all SMT equipment supplier, YOU have the power, just ask the guys that tons
of info will come to you easily, that is the advantage to work for BIG
company )
Thanks
Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil
> -----Original Message-----
> From: Narayana Vishy-CVN002 [SMTP:[log in to unmask]]
> Sent: 15 de Agosto de 1999 00:03
> To: [log in to unmask]
> Subject: [TN] 2D POST-PRINT INSPECTION - MPM PRINTERS
>
> > hi netters :
> >
> > 1) Any comments on the performance of 2D post-print inspection on MPM
> > printers ? (Ver 6 software ) .
> >
> > 2) What is the typical false-failure rates for catching the following :
> > * Missing paste
> > * Smeared paste
> >
> > 3) What are the factors to look for a good performance ?
> >
> > 4) How is their performance on flex circuits ?
> >
> --------------------------------------------------------------------------
> > --------
> > Vishy
> > Motorola Penang , Malaysia
> >
> --------------------------------------------------------------------------
> > --------
> >
>
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