TECHNET Archives

July 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Thu, 15 Jul 1999 13:37:37 -0500
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, nishath yasmeen <[log in to unmask]>
Subject:
Non-uniform copper plating
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset=us-ascii
Organization:
Texas Instruments
From:
nishath yasmeen <[log in to unmask]>
Parts/Attachments:
text/plain (27 lines) 
We are seeing non uniform plated copper deposits in very small areas on
silicon wafers from the acid copper plating bath.

I can understand the non uniformity across areas which are large (
inches) but these areas measure in micron range. The thickness profile
of this area looks like a staircase on the profilometer.  Is this a flow
problem? Does this depend on the current density?
What other factors do I need to consider for uniformity improvement?

Any suggestions will be greatly appreciated.
Thanks,
Yasmeen

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2