We are seeing non uniform plated copper deposits in very small areas on silicon wafers from the acid copper plating bath. I can understand the non uniformity across areas which are large ( inches) but these areas measure in micron range. The thickness profile of this area looks like a staircase on the profilometer. Is this a flow problem? Does this depend on the current density? What other factors do I need to consider for uniformity improvement? Any suggestions will be greatly appreciated. Thanks, Yasmeen ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################