TECHNET Archives

July 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Transfer-Encoding:
7bit
Sender:
TechNet <[log in to unmask]>
Subject:
NI/AU UNDER BETWEEN COPPER
From:
[log in to unmask]
Date:
Mon, 26 Jul 1999 11:19:52 EDT
Content-Type:
text/plain; charset="us-ascii"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (27 lines) 
I just looked at a product where the manufacturer has managed to
overplate nickel/gold with copper.  This occurs on the surface conductors
and also in holes.

I have looked in the design and board documents, but cannot find anything
that addresses the reliability of such a condition.  I know putting a
"meltable"
material between layers of copper can wreak havoc, but what about
ni/au?

Susan Mansilla
Robisan Lab

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2