Yasmeen

Do not anneal it or the grain will grow in size and reorient and your grain
size measurement will be meaningless.  You can measure grain size with a good
SEM  or determine grain size with x-ray diffraction.

Typically the plated copper grain starts small, but grows larger as it
plates.  Depending on the plating system it may grow in oriented long thin
grains or fat chunky grains or very small grains a few atoms in diameter.

As you are talking about wafers, I suspect you are dealing with thicknesses
less than 1/10 micron thick.  The grain size for this thickness may be only
30-50  angstroms thick and randomly oriented.  Epitaxy will also influence
the size and orientation, so it may depends on what your substrate looks like
to the plating process.

Suggest you go for diffraction first and determine lattice parameters and
orientation.  You can then calculate the effective particle size or grain
size.

Phil Hinton

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