Ryan,
My company actually builds a conveyorized preheater oven which is being used
for odd form assembly (preheat then robotic soldering) and also for
preheating prior to rework. A system like this could be used but is more
expensive than the hot plates. Depending upon how many rework stations you
were feeding though, the preheater oven could be more cost effective than
the hot plates.
Sincerely,
Brian Stumm
ETS, LLC
>This is a multi-part message in MIME format.
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>Mornin!
>
> We just had vendor in here pitching a "low-temperature rework system"
>which was intriguing, but too expensive. He did get me to thinking though,
>beyond heating ceramic caps before hand-soldering them, it seems like it
>would be advantageous to pre-heat the board according to the original
>profile, to below reflow temperatures, then just touch the leads of the part
>to be reworked with a soldering iron. The iron would only have to be around
>500F to reflow the solder, because it would only have to be heated 20-30
>degrees more to reach reflow temperatures. Is anybody else out there
>pre-heating boards before rework? Is it necessary? Wouldn't this method
>stress the parts and pads less, because of the slower heat-up? Is
>pre-heating the parts enough? If it is a good idea, is there a cheaper way
>to do it than buying a $700 pre-heat plate for each rework station?
>Hope you all are enjoying as beautiful weather as we are here in Michigan!
>
>-Ryan Jennens
>TelGen Corporation
>
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>Content-Type: text/html;
> charset="iso-8859-1"
>Content-Transfer-Encoding: quoted-printable
>
><!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
><HTML><HEAD>
><META content=3D"text/html; charset=3Diso-8859-1" =
>http-equiv=3DContent-Type>
><META content=3D"MSHTML 5.00.2314.1000" name=3DGENERATOR></HEAD>
><BODY bgColor=3D#ffffff>
><DIV><FONT face=3DArial size=3D2><SPAN=20
>class=3D09081914-30041999>Mornin!</SPAN></FONT></DIV>
><DIV><FONT face=3DArial size=3D2><SPAN=20
>class=3D09081914-30041999></SPAN></FONT> </DIV>
><DIV><FONT face=3DArial size=3D2><SPAN =
>class=3D09081914-30041999> We=20
>just had vendor in here pitching a "low-temperature rework system" which =
>was=20
>intriguing, but too expensive. He did get me to thinking though, =
>beyond=20
>heating ceramic caps before hand-soldering them, it seems like it would =
>be=20
>advantageous to pre-heat the board according to the original profile, to =
>below=20
>reflow temperatures, then just touch the leads of the part to be =
>reworked with a=20
>soldering iron. The iron would only have to be around 500F to =
>reflow the=20
>solder, because it would only have to be heated 20-30 degrees more to =
>reach=20
>reflow temperatures. Is anybody else out there pre-heating boards =
>before=20
>rework? Is it necessary? Wouldn't this method stress the =
>parts and=20
>pads less, because of the slower heat-up? Is pre-heating the parts =
>
>enough? If it is a good idea, is there a cheaper way to do it than =
>buying=20
>a $700 pre-heat plate for each rework station? =
></SPAN></FONT></DIV>
><DIV><FONT face=3DArial size=3D2><SPAN class=3D09081914-30041999>Hope =
>you all are=20
>enjoying as beautiful weather as we are here in =
>Michigan!</SPAN></FONT></DIV>
><DIV><FONT face=3DArial size=3D2><SPAN=20
>class=3D09081914-30041999></SPAN></FONT> </DIV>
><DIV><FONT face=3DArial size=3D2><SPAN class=3D09081914-30041999>-Ryan=20
>Jennens</SPAN></FONT></DIV>
><DIV><FONT face=3DArial size=3D2><SPAN class=3D09081914-30041999>TelGen=20
>Corporation</SPAN></FONT></DIV></BODY></HTML>
>
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