Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 5 May 1999 08:21:35 -0400 |
Content-Type: | text/plain |
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Sunil,
Also check your solder for metallic impurities. Some favour the formation
of icicles.
Bev Christian
Nortel Networks
> -----Original Message-----
> From: Feng Yi,BISC PD IE(BJ) [SMTP:[log in to unmask]]
> Sent: Wednesday, May 05, 1999 4:38 AM
> To: [log in to unmask]
> Subject: Re: [TN] Icicle formation on wave soldering
>
> Dear Sunil,
> the same problem has been found in our company, and we solved it though
> below mentioned methods.
>
> 1) increase pre-heat tempreture to 160¡æ
> 2)increase the spraying flux
> 3)only use single wave solder, not double wave solder
>
>
> Best Regards
>
>
> Qu Zenglong
>
> Industrial Engineering Department
> Production Division
> BISC, China
> Tel: 0086-10-64346323
> Fax:0086-10-64367731
> e-mail: [log in to unmask]
>
> ----------
> From: Sunil Gupta[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Wednesday, May 05, 1999 11:49 AM
> To: [log in to unmask]
> Subject: [TN] Icicle formation on wave soldering
>
> While wave soldering the mixed technology boards I am facing the
> problem of
> icicles being formed on the solder side. The icicles are only on SMDs
> (capacitors and resistors, there are no other SMDs) while not observed on
>
> lead thru components. The machine parameters are:
> Bath temperature: 245 deg C
> Conveyor speed: 1m per minute
> Fluxing thru foam fluxer
> PCB temperature before soldering: 100 deg C
> Preheat zone length: 1.5 m
>
> The problem got solved by heating the boards at 60 deg C and than
> passing
> them thru the fluxing and soldering.
>
> I want to eliminate the Icicle problem and also remove the
> requirement of
> baking.
> Can you give me ideas.
>
> regards
>
> Sunil Gupta
> Manager Process Engineering
> Tata Telecom Ltd.
>
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