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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 4 May 1999 08:51:45 -0500 |
Content-Type: | multipart/mixed |
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Steam aging is the accepted standard for tin lead, but this procedure is more
effective at identifying defects in surface finishes rather than predicting
solderable shelf life. See J/STD 003 for details.
-003 includes requirements only for solder because this is the most studied
finish, but many of the other finishes studied don't survive even the 8 hour
test.
BADA wrote:
>
> Hi
>
> How to simulate a Pcb ageing equivalent to a one year storage ?
>
> Is there any standard about this subject ?
>
> Thank you,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
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--
Regards,
Jim Reed
Raytheon Systems Company
512-250-7172 (Voice)
512-250-7967 (Fax)
[log in to unmask] (email address)
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