Steam aging is the accepted standard for tin lead, but this procedure is more effective at identifying defects in surface finishes rather than predicting solderable shelf life. See J/STD 003 for details. -003 includes requirements only for solder because this is the most studied finish, but many of the other finishes studied don't survive even the 8 hour test. BADA wrote: > > Hi > > How to simulate a Pcb ageing equivalent to a one year storage ? > > Is there any standard about this subject ? > > Thank you, > > Vincent Bada > Process Engineer > Alcatel Etca > Charleroi > Belgium > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ -- Regards, Jim Reed Raytheon Systems Company 512-250-7172 (Voice) 512-250-7967 (Fax) [log in to unmask] (email address)