Steam aging is the accepted standard for tin lead, but this procedure is more
effective at identifying defects in surface finishes rather than predicting
solderable shelf life.  See J/STD 003 for details.

-003 includes requirements only for solder because this is the most studied
finish, but many of the other finishes studied don't survive even the 8 hour
test.

BADA wrote:
>
> Hi
>
> How to simulate a Pcb ageing equivalent to a one year storage ?
>
> Is there any standard about this subject ?
>
> Thank you,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
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--
Regards,
Jim Reed
Raytheon Systems Company
512-250-7172 (Voice)
512-250-7967 (Fax)
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