Sender: |
|
X-To: |
|
Date: |
Tue, 4 May 1999 08:51:45 -0500 |
Reply-To: |
|
Subject: |
|
From: |
|
Content-Type: |
multipart/mixed; boundary="------------428B5BCB407F2D2FBDE0618D" |
Organization: |
Raytheon Systems Company |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Steam aging is the accepted standard for tin lead, but this procedure is more
effective at identifying defects in surface finishes rather than predicting
solderable shelf life. See J/STD 003 for details.
-003 includes requirements only for solder because this is the most studied
finish, but many of the other finishes studied don't survive even the 8 hour
test.
BADA wrote:
>
> Hi
>
> How to simulate a Pcb ageing equivalent to a one year storage ?
>
> Is there any standard about this subject ?
>
> Thank you,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################
--
Regards,
Jim Reed
Raytheon Systems Company
512-250-7172 (Voice)
512-250-7967 (Fax)
[log in to unmask] (email address)
|
|
|