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April 1999

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Subject:
From:
Joe Felts <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 3 Apr 1999 15:07:53 -0700
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See this year's IPC Technical Proceedings S15-4-1 "The War on Plating Pits
- An Update" by Richard Olsen of DuPont.
Root cause is normally air supersaturation.
Check that air bubbles cannot enter your filter pump suction, ensure that
you have plenty of NPSH so that your pump does not cavitate, and/or try
increasing to a larger micron filter.

J.Felts

-----Original Message-----
From:   Gwerder Lorenz [SMTP:[log in to unmask]]
Sent:   Saturday, April 03, 1999 1:08 AM
To:     [log in to unmask]
Subject:        [TN] Pitting

We are a PCB manufacturer and are currently dealing with the "PITTING"
problem. Small holes, craters in the electrolitic copper.
Is there any acceptability guideline corresponding this problem. I did
not find it in the IPC-A-600.


Thanks for your help


Lorenz Gwerder


[log in to unmask] <mailto:[log in to unmask]>
www.photochemie.ch <http://www.photochemie.ch>

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