In a message dated 03/04/99  10:05:05AM,  [log in to unmask] writes:

>  Dear Technetters
>  Has anyone heard about something called side braze DIP or bottom brazed
>  DIP? What does it mean?
>  Is there a physical difference in the size between a plastic DIP and a
>  ceramic DIP, i.e. is there a difference in the footprint.
>  --
>  Best Regards                                       ```
>  Khaled H. Fouad
++++++++
These go back to when I had hair.
DIP or  these days DIL = Dual In line Package.
Originally the body of multileaded devices, ICs etc, was made from ceramic
and the metal leads were attached by brazing either to the sides or the
bottom. [This technology is still used on very high reliability or low run or
high power products (eg space or Mil) and a common application still is
ceramic PGAs.]

When plastic bodied devices were introduced they were footprint compatible
with the ceramic packaged parts, usually with a slightly smaller body.

NOTE: If you are looking at old products the major change between then and
now is that these were THROUGH HOLE devices not SMT and the leads are 0.010"
pitch,

If you go very far back it is not possible to state with 100% certainty that
they will all be compatible. However it is reasonable to assume that if you
have say a 16pin DIL in ceramic that it will have the same footprint as a 16
pin plastic device.

Mike Fenner

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