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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 1 Apr 1999 12:34:09 +0100 |
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Hello Everybody
I am currently reflowing with a convection oven (No Nitrogen). A board
that has perfect solder joints apart from grainy solder joints on one
particular component (QFP). Other components on the board resistors/caps
and components of similar size are fine.
Therefore I don't think there is a problem with the oven profile.
This component does go through an extra process before hand.
Initially the component is supplied with no pins (Very long story,
don't ask!)
These are attached to the body of the component using an aluminum
jig/fixture to hold them in place. The legs are supplied
pre-soldered.
RMA flux is then applied (liberally) to the area to be soldered.
The jigs with the components are then placed through a vapour phase oven
for soldering .
Is it possible that the legs are being contaminated by Aluminum or its
oxide from the jig/fixture, if the flux is reacting the Aluminum.
Would aluminum contamination give grainy joints?
What else can cause grainy joints?
Thanks for any help
Stephen Bonaccorsi
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