Hello Everybody I am currently reflowing with a convection oven (No Nitrogen). A board that has perfect solder joints apart from grainy solder joints on one particular component (QFP). Other components on the board resistors/caps and components of similar size are fine. Therefore I don't think there is a problem with the oven profile. This component does go through an extra process before hand. Initially the component is supplied with no pins (Very long story, don't ask!) These are attached to the body of the component using an aluminum jig/fixture to hold them in place. The legs are supplied pre-soldered. RMA flux is then applied (liberally) to the area to be soldered. The jigs with the components are then placed through a vapour phase oven for soldering . Is it possible that the legs are being contaminated by Aluminum or its oxide from the jig/fixture, if the flux is reacting the Aluminum. Would aluminum contamination give grainy joints? What else can cause grainy joints? Thanks for any help Stephen Bonaccorsi ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################