TECHNET Archives

March 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
José Alejandro Becerra Chiu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Mar 1999 12:15:41 -0600
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (37 lines)
Technetters

I have some questions that could be
helpful to my thesis about PBGA
reliability.

I'm planning to perform accelerated thermal
cycling  (ATC) to PBGA components, and

1. Equipment with thermal cycling between
-10C to 65C with a heat rate of 1C/min
is available, Could this cycles
be optimum to obtain reliability data?

2.Where can I find information about ATC
suitable to PBGA?

3. Does IPC-SM-785 is applicable to PBGA?

Alejandro Becerra
Research assistant
Laboratory for Electronic Manufacturing
ITESM, Monterrey, N.L. Mexico
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2