Technetters

I have some questions that could be
helpful to my thesis about PBGA
reliability.

I'm planning to perform accelerated thermal
cycling  (ATC) to PBGA components, and

1. Equipment with thermal cycling between
-10C to 65C with a heat rate of 1C/min
is available, Could this cycles
be optimum to obtain reliability data?

2.Where can I find information about ATC
suitable to PBGA?

3. Does IPC-SM-785 is applicable to PBGA?

Alejandro Becerra
Research assistant
Laboratory for Electronic Manufacturing
ITESM, Monterrey, N.L. Mexico
[log in to unmask]

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