Jeff,
MInimum Ni thickness requirements  vary depending on the requirements the
end product must meet.  The nickel's main purpose is as a migration barrier
between the substrate metalizations and gold .  In most cases 100 -  200u"
of nickel is sufficient.  (as a matter of fact most part specifications
I've worked with for gold finishes request nickel thicknesses in this
rannge).

Take care,

Bruce Stacy





JEFF PERKINS <[log in to unmask]> on 03/03/99 09:45:24 AM

Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,        JEFF
      PERKINS" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Bruce Stacy/ECSDOMAIN)
Subject:  [TN] Minimum Ni thickness





        We have a ceramic submount where the finish metallization is Ni-Au.
Interconnects are formed from a AuSn solder and Au wirebonds.  Does anyone
have pointers to specifications for minimum Ni thickness?

        Thanks,
                Jeff Perkins
                Epitaxx



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