From this would you expect that (holding all other varaibles constant) you
would get a thicker IMC layer on the final solder joint with thin HAL boards
than with more normal, thicker HAL?

> -----Original Message-----
> From: [log in to unmask]
> [SMTP:[log in to unmask]]
> Sent: Wednesday, February 17, 1999 11:59 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Intermetalics
>
>
> It would not be at all unexpected to observe a higher relative
> concentration of tin in an area determined to have a  "thin" HAL deposit.
> The XRF is responding to the ratio of tin to lead, and given you are
> approaching the copper/solder interface, and more specifically the
> tin/copper interface, it would be naturally preferential to tin
> concentration.
>
> Sounds like you are within expected conditions, other than the thin solder
> deposits. May I assume they are on larger ground areas? There is a direct
> correlation between deposit thickness and area size under given conditions
>
> Hope this helps!
>
> Joseph Webb
> TET/Halco
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text
> in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for
> additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700
> ext.312
> ################################################################
>
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################