Hi technetters ,
The recent discussion concerning intermetalics layer growth was very
interesting .
We made some measurements on our HASL boards using XRF equipment .
The results were completly contrary to theory :
On high and normal solder thickness areas ( 7 to 17 microns ) we got 60 to
70% of tin , as expected .
On low thickness areas ( 2 microns and less ) we got 85 to 90% of tin .
Those figures we got on quite big number of boards from different manufacturer .
Where is the catch : measurement error or something different ????
Best regards
Edward Szpruch
Eltek Ltd - Israel   Tel :  972 - 3 - 9305050 , Fax : 972 - 3 - 9309581
Sgoola industrial Zone , POB 159 , 49101 Petah Tikva , Israel
e-mail :  [log in to unmask]

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