HELLO THERE,

GOOD DAY TO EVERYONE !!!  I would like to make an inquiry regarding
the basic assembly flow of digital camera assembly... I have done an
initial research and found out that it is almost the same as the
present situation on the SMT(how about new technologies e.g.
BGA/CSP/Flipchip,etc)  but involves components as small as
0402...Pls. correct me if I am wrong... What types of SMT machines
placement (parameters) must I consider in choosing the proper one ???
 I also heard that the testing of these cameras involve few
machines... Can someone help  me on the different machines and
test procedures that I must consider... I also would like to ask if
there is a special type of solder paste used in this assembly or
still use the usual eutectic paste....    Is there a strict
environment for this kind of technology ???

Thank you very much in advance for answering my mail...
I am very grateful to all of you !!!
Regards to everyone and God Bless !!!





JB

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