HELLO THERE, GOOD DAY TO EVERYONE !!! I would like to make an inquiry regarding the basic assembly flow of digital camera assembly... I have done an initial research and found out that it is almost the same as the present situation on the SMT(how about new technologies e.g. BGA/CSP/Flipchip,etc) but involves components as small as 0402...Pls. correct me if I am wrong... What types of SMT machines placement (parameters) must I consider in choosing the proper one ??? I also heard that the testing of these cameras involve few machines... Can someone help me on the different machines and test procedures that I must consider... I also would like to ask if there is a special type of solder paste used in this assembly or still use the usual eutectic paste.... Is there a strict environment for this kind of technology ??? Thank you very much in advance for answering my mail... I am very grateful to all of you !!! Regards to everyone and God Bless !!! JB ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################