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January 1999

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Subject:
From:
"Sauer, Steven T." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Jan 1999 13:32:00 E
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Hi Don,
What type of solder paste are you using (water borne or alcohol based)?
Amount and type of residue left on the assy after reflow?  Is this
residue flowing onto/into PTHs?  Have you processed the assembly with TH
only to baseline a best case?
This additional info will help in determining possible solutions.
 Thanks.

Steve

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