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January 1999

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Subject:
Dewetting on NiAu
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 22 Jan 1999 12:31:03 +0100
Content-Type:
text/plain
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text/plain (27 lines) 
Hi all

I have a request of a company working with us. They face the problem that
their solder joints of QFP's on NiAu pad surfaces ( Au electroless plated )
does not bond in the reflow process. Trials have been made with various
suppliers of PCB's, all with the same result. All the other components seem
to solder Ok. Has somebody else gone through this? Does somebody know the
reason for the problem and maybe a solution?
Thanks for your help.

Best regards


Guenter

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