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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 14 Jan 1999 09:07:42 -0600 |
Content-Type: | text/plain |
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Dear TechNetters,
I have a fairly simple problem that I am looking for advice on.
We use no-clean solder paste. How do some of you clean mis-printed
boards with no-clean paste? How do you insure you get all of the paste
out of the vias? If it is a double side reflow board and the first side
is already populated, how do you clean mis-prints on side two and insure
that paste from vias underneath large QFPs is completely removed? If
you use certain chemicals and/or ultrasonic agitation, are there
specific SMT components that are damaged by the use of these techniques?
Thanks in advance for your replys.
Wade Oberle
Sr. Mfg. Engineer
Manutronics, Inc.
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