Dear TechNetters, I have a fairly simple problem that I am looking for advice on. We use no-clean solder paste. How do some of you clean mis-printed boards with no-clean paste? How do you insure you get all of the paste out of the vias? If it is a double side reflow board and the first side is already populated, how do you clean mis-prints on side two and insure that paste from vias underneath large QFPs is completely removed? If you use certain chemicals and/or ultrasonic agitation, are there specific SMT components that are damaged by the use of these techniques? Thanks in advance for your replys. Wade Oberle Sr. Mfg. Engineer Manutronics, Inc. [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################