Dear Technetters,
        I am having a problem with SMT adhesive sticking to some types
of solder mask.  Does someone out there have experience with using SMT
adhesive on glossy boards vs. matte finish boards.  I am using Loctite
3609 or Epibond 7275 or Epibond 7275-1 with a cure cycle of 145-150
degrees centigrade for 4-5 minutes.  Is there an SMT adhesive or cure
cycle that works better with glossy boards?  We seem to have a problem
with adhesion at room temperature and at wave solder temperatures.  We
run a standard wave solder profile and have even increased the wave
speed to 5.75 feet/minute from our norm of 4.5-5.0 feet/minute.  This
helps but we run the risk of voids and poor solder connections on some
components.
If I cure the boards and then use a 'push' tester to measure the force
required to remove the 'glued' components, is there a standard for
minimum and maximum expected force for removal?  I have heard of some
people using a custom socket and a torque wrench to measure the strength
of the cured adhesive.  Is there a standard specification for this test
method?  Which test method do you think is best?  The tests mentioned
above are done at room temperature.  Is there a way to measure the 'hot'
strength of the adhesive bond?

Thanks in advance.

Wade Oberle

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