Dear Technetters, I am having a problem with SMT adhesive sticking to some types of solder mask. Does someone out there have experience with using SMT adhesive on glossy boards vs. matte finish boards. I am using Loctite 3609 or Epibond 7275 or Epibond 7275-1 with a cure cycle of 145-150 degrees centigrade for 4-5 minutes. Is there an SMT adhesive or cure cycle that works better with glossy boards? We seem to have a problem with adhesion at room temperature and at wave solder temperatures. We run a standard wave solder profile and have even increased the wave speed to 5.75 feet/minute from our norm of 4.5-5.0 feet/minute. This helps but we run the risk of voids and poor solder connections on some components. If I cure the boards and then use a 'push' tester to measure the force required to remove the 'glued' components, is there a standard for minimum and maximum expected force for removal? I have heard of some people using a custom socket and a torque wrench to measure the strength of the cured adhesive. Is there a standard specification for this test method? Which test method do you think is best? The tests mentioned above are done at room temperature. Is there a way to measure the 'hot' strength of the adhesive bond? Thanks in advance. Wade Oberle ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################