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Thu, 31 Dec 1998 17:14:28 +0200 |
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Hi technetters ,
What are the existing and working technologies for electrolytic copper and
tin lead plating of blind vias , laser drilled ?
We are testing now making tests with 0.2 mm diameter , 0.3 mm deep laser
drilled vias . The stage of permanganate desmear and electroless copper
plating was performed in vertical line without special efforts . We tried
different current densities in vertical electrolylic stage , but we got very
poor copper distribution along the wall : 20 microns in the upper part , 5
microns on the bottom and on the lower part of the wall . We just presume ,
tha the same problem will be for tin-lead stage of pattern plating .
Best regards and Happy New Year 1999 !
Edward Szpruch
Eltek Ltd - Israel
e-mail : [log in to unmask]
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