Hi technetters , What are the existing and working technologies for electrolytic copper and tin lead plating of blind vias , laser drilled ? We are testing now making tests with 0.2 mm diameter , 0.3 mm deep laser drilled vias . The stage of permanganate desmear and electroless copper plating was performed in vertical line without special efforts . We tried different current densities in vertical electrolylic stage , but we got very poor copper distribution along the wall : 20 microns in the upper part , 5 microns on the bottom and on the lower part of the wall . We just presume , tha the same problem will be for tin-lead stage of pattern plating . Best regards and Happy New Year 1999 ! Edward Szpruch Eltek Ltd - Israel e-mail : [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################