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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 11 Dec 1998 14:37:51 -0500 |
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I've been asked the technical difference between a via and a plated
through hole. We are dealing with through hole technology. Should we
be specifying interfacial connections as one, or both of these types of
holes. I have an old drawing that specifies interfacial connections shall
be IAW MIL-STD-275. I know that spec has been replaced. Like I said,
this is an old drawing. We are currently using IPC-A-610 to inspect
assemblies and wonder if the note should be updated to reflect this
spec. The only place I see the word "Interfacial Connection" used in the
spec is para.4.2.4 which is SMT vias, not component plated through
holes. Maybe I should just remove the note, it almost seems redundant to
our assembly acceptance requirements.
Any comments or ideas?
Larry Campbell
BFGoodrich, Avionics Systems
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