I've been asked the technical difference between a via and a plated through hole. We are dealing with through hole technology. Should we be specifying interfacial connections as one, or both of these types of holes. I have an old drawing that specifies interfacial connections shall be IAW MIL-STD-275. I know that spec has been replaced. Like I said, this is an old drawing. We are currently using IPC-A-610 to inspect assemblies and wonder if the note should be updated to reflect this spec. The only place I see the word "Interfacial Connection" used in the spec is para.4.2.4 which is SMT vias, not component plated through holes. Maybe I should just remove the note, it almost seems redundant to our assembly acceptance requirements. Any comments or ideas? Larry Campbell BFGoodrich, Avionics Systems ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################