TECHNET Archives

November 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Hiteshew, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Nov 1998 16:40:15 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Hey Guys,
        Can anyone direct to me to any technical papers (or books) comparing
various methods of heat sinking PWBs. I'm looking for information that
compares cost, thermal efficiency, mechanical strength, etc. Even papers
that addressed only a single method (no comparison) would be of value.
Specifically, the options we're considering are:

A) Nickel plated copper laminated to the primary component side.

B) Aluminum plate bonded to the secondary side with thermally conductive and
compliant glue.

C) Copper-invar-copper core material.

Thanks for your help.

 Michael Hiteshew
 Lockheed Martin Launching Systems
 [log in to unmask]
 (410) 682-1259

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2