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November 1998

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Subject:
Via holes on SMD pads?
From:
Thomas Martin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Nov 1998 11:08:59 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Michael

 You and your customer might also both benefit by
reading James Blankenhorn's article "Increasing
Density by Placing Vias in Lands," in the Nov/98
issue of "Printed Circuit Design" magazine. The
article provides some design guidelines for more
successful use of vias in lands when required by
density/reduced lead inductance considerations.

TOM Martin

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