Aside from the "easy reading"-- type papers in the industry magazines and
the usual set of Lowenheim books that probably every person involved in
electroplating has, to my mind, probably one of the most impressive works
that I've seen on the subject is Lubomyr Romankiw's of IBM paper entitled
"Fundamental Study of Acid Copper Through-hole Electroplating Process"
presented in 1986 at Symposium on Electrodeposition Technology and
published by Electrochemical Society in 1987 Proceedings (be prepared for a
fair dose of theoretical electrochemistry).

 And finally, if you feel adventurous enough to try to figure out the
difference between overvoltage and polarization, there are a number of
books available on fundamental theoretical/applied electrochemistry, like
multi-volume John Bockris' "Comprehensive Treatise" and "Modern
Electrochemistry"  or Heinz Gerisher's "Advances in Electrochemical
Science".

Happy reading.

Eric Yakobson




"fgolisan" <[log in to unmask]> on 11/10/98 11:26:02 AM

To:   [log in to unmask]
cc:    (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
Subject:  Copper Plating





     Eric,

         While I agree that most techNetters would be bored to death. I am
     very interested in this subject. Can you suggest books or papers that
     may be generally available.

     Thanks,

     Fred

     ______________________________________________________________________
     ______________________________________________________________________

     Kelly,

     The greater is the difference in the cathode polarization (on high/low
     current density points of the cathode) -- the more uniform is the
     current distribution.

     It is really difficult to properly explain this statement without
     going into the details and definitions of primary/secondary current
     distribution, overpotential and polarization, which without any doubt
     would bore most TechNetters to death.

     To put it simplistically, high polarization on high current density
     points means that actual current density on them is lower then it
     otherwise would have been if this polarization did not exist.

     If you would like to discuss this subject any further, please contact
     me off line.

     Eric Yakobson




     Kelly Kovalovsky <[log in to unmask]> on 11/09/98 07:21:58 AM

     To:   [log in to unmask]
     cc:    (bcc: Eric Yakobson/AlphaPCFabUS/Cookson) Subject:  Re: [TN]
     Copper plating & Copper thickness

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