Aside from the "easy reading"-- type papers in the industry magazines and the usual set of Lowenheim books that probably every person involved in electroplating has, to my mind, probably one of the most impressive works that I've seen on the subject is Lubomyr Romankiw's of IBM paper entitled "Fundamental Study of Acid Copper Through-hole Electroplating Process" presented in 1986 at Symposium on Electrodeposition Technology and published by Electrochemical Society in 1987 Proceedings (be prepared for a fair dose of theoretical electrochemistry). And finally, if you feel adventurous enough to try to figure out the difference between overvoltage and polarization, there are a number of books available on fundamental theoretical/applied electrochemistry, like multi-volume John Bockris' "Comprehensive Treatise" and "Modern Electrochemistry" or Heinz Gerisher's "Advances in Electrochemical Science". Happy reading. Eric Yakobson "fgolisan" <[log in to unmask]> on 11/10/98 11:26:02 AM To: [log in to unmask] cc: (bcc: Eric Yakobson/AlphaPCFabUS/Cookson) Subject: Copper Plating Eric, While I agree that most techNetters would be bored to death. I am very interested in this subject. Can you suggest books or papers that may be generally available. Thanks, Fred ______________________________________________________________________ ______________________________________________________________________ Kelly, The greater is the difference in the cathode polarization (on high/low current density points of the cathode) -- the more uniform is the current distribution. It is really difficult to properly explain this statement without going into the details and definitions of primary/secondary current distribution, overpotential and polarization, which without any doubt would bore most TechNetters to death. To put it simplistically, high polarization on high current density points means that actual current density on them is lower then it otherwise would have been if this polarization did not exist. If you would like to discuss this subject any further, please contact me off line. Eric Yakobson Kelly Kovalovsky <[log in to unmask]> on 11/09/98 07:21:58 AM To: [log in to unmask] cc: (bcc: Eric Yakobson/AlphaPCFabUS/Cookson) Subject: Re: [TN] Copper plating & Copper thickness ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################