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November 1998

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TechNet <[log in to unmask]>
Subject:
FINE LINE COPPER PLATING
From:
"Huffman, Connie - LYPME" <[log in to unmask]>
Date:
Thu, 12 Nov 1998 12:30:30 -0500
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text/plain
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"TechNet E-Mail Forum." <[log in to unmask]>, "Huffman, Connie - LYPME" <[log in to unmask]>
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Hello technet,
We are trying to plate 5 mil lines in a typical acid copper bath, and
are experience burning and overgrowth in some areas.  Should my plating
parameters (sulfuric conc., hydrochloric conc., copper conc) change for
finer lines?  Please provide recommended parameters.
Thanks
cbh

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