Hello All, I have a board with a 357 ball BGA that we placed and reflowed. I
x-ray inspected the BGA after reflow and I found two balls that look like
the solder was stolen by the vias next to them. I checked the soldermask
gerber layer and it turns out that there is no clearance between the vias
and the BGA's pads(they touch). I'm kind of stumped, the ball on this x-ray
doesn't look acceptable. We have more of these boards to build and the vias
touch the pads on all the boards. Is there a way to alleviate this problem
(if it is a problem). We are not testing these boards for our customer yet
so we are not sure about a continuity test. Can I flow solder into the vias
before we place the BGA or somehow mask the via before Surface mount and
reflow. Help!!!

I can send a picture of the X-ray to anyone interested. Technet said its too
big of a file (only 160KB).

Thanks,

Tim Stammely
Manufacturing Engineer
MSI

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