Hello All, I have a board with a 357 ball BGA that we placed and reflowed. I x-ray inspected the BGA after reflow and I found two balls that look like the solder was stolen by the vias next to them. I checked the soldermask gerber layer and it turns out that there is no clearance between the vias and the BGA's pads(they touch). I'm kind of stumped, the ball on this x-ray doesn't look acceptable. We have more of these boards to build and the vias touch the pads on all the boards. Is there a way to alleviate this problem (if it is a problem). We are not testing these boards for our customer yet so we are not sure about a continuity test. Can I flow solder into the vias before we place the BGA or somehow mask the via before Surface mount and reflow. Help!!! I can send a picture of the X-ray to anyone interested. Technet said its too big of a file (only 160KB). Thanks, Tim Stammely Manufacturing Engineer MSI ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################